Printed circuit board identification and traceability

The label on a printed circuit board is subjected to significant stress throughout the production process. Poor quality or damaged printing can have an impact on production process monitoring, on logistics and on the use of the printed circuit board in the end product.
Such message legibility and durability requirements are at the heart of the process of selecting a print solution.

Printed circuit board label printing

The technologies used in component soldering and residue cleaning are very demanding: for example, temperatures can reach as high as 300°C (572°F) and the dispersal of solvents under high pressure may easily compromise the label and printed message.
Laboratory ageing tests for demanding sectors (e.g. aeronautics, automotive and armaments) reproduce the high mechanical and thermal stress to which the printed label is subjected (resistance to UV, humidity, heat, cold, temperature variation, etc.).
Certain international print performance regulations (UL standard) and those covering the use of regulated substances must also form part of the process for selecting the print technology.